ESD9X3.3ST5G Series,
SZESD9X3.3ST5G Series
Transient Voltage
Suppressors
Micro ? Packaged Diodes for ESD Protection
The ESD9X Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
http://onsemi.com
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
1
2
XM
cellular phones, MP3 players, digital cameras and many other portable
applications where board space is at a premium.
Specification Features:
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.039 ″ x 0.024 ″ (1.0 mm x 0.60 mm)
? Low Body Height: 0.017 ″ (0.43 mm) Max
? Stand ? off Voltage: 3.3 V ? 12 V
? Low Leakage
? Response Time is Typically < 1 ns
? ESD Rating of Class 3 (> 16 kV) per Human Body Model
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
PPAP Capable
? These are Pb ? Free Devices
Mechanical Characteristics:
PIN 1. CATHODE
2. ANODE
MARKING
DIAGRAM
SOD ? 923
CASE 514AA
X = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device Package Shipping ?
ESD9XxxST5G SOD ? 923 8000/Tape & Reel
(Pb ? Free)
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V ? 0
SZESD9XxxST5G SOD ? 923
(Pb ? Free)
8000/Tape & Reel
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
IEC 61000 ? 4 ? 2 (ESD)
Contact
Air
Symbol
Value
± 30
± 30
Unit
kV
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Junction and Storage Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
?
P D
T J , T stg
T L
150
? 55 to
+150
260
mW
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2012
October, 2012 ? Rev. 7
1
Publication Order Number:
ESD9X3.3ST5G/D
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